3D SPI can completely solve the problem of shadow and random
reflection in the detection process, so that solder paste 3D
detection
accuracy is higher; equipped with a 5M pixel high-speed camera,
detection speed is faster, the image is more delicate and rich; it
is an ideal
choice for high-speed and high-precision production lines.
TECHNICAL PARAMETERS:
| Model | A510 | A510DL | A1200 |
| PCB Size | 55*55 ~450*450mm | 55*55 ~450*310mm Dual | 55*55 ~ 1200*650mm |
| PCB Tickness | 0.5 ~ 7.0mm |
| PCB Weight | ≤5.0kg |
| Conveyor Adjustment | Manual/automatic |
| Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient
tin, excessive tin, bridging, offset, mal-shapes, surface
contamination) |
| Paste Height | 0 ~ 550um |
| Min Pad Pitch | ≥100um |
| Measure Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation,
Phase Measurement Profilometry) |
| Inspection Head Quantity | 1 |
| Camera Pixel | 5M, (10M/12M as option) |
| Detection Speed | 0.35 ~ 0.5s/FOV |
| Program Time | 5 ~ 10min |
| Data Type | Gerber Data 274D/274X, Scan PCB |
| Power | AC220,50/60Hz,1KVA |
| Machine Dimension | 1000*1150*1530mm | 1000*1350*1530mm | 1730*1420*1530mm |
| Weight | 965kg | 1200kg | 1600kg
|
Core Technology and Features
1.PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY
Phase modulation profiling technology (PMP) is used to achieve
three-dimensional measurement of printed solder paste, which can
greatly improve measurement accuracy while ensuring high-speed
inspection.
2.ACTIVE RGB 2D LIGHT SOURCE,2D LIGHTING SOURCES
Patented RGB Tune function takes Red, Green and Blue images and
with unique filter algorism, to solve solder bridge detection false
alarm and relative zero surface uncertain issue. In the mean time,
provide the 2D/3D measurements and image of printed solder paste.
ooperate with 2D lighting sources avoids problems caused by the
angle of the red RGB color distortion effect in solder; RGB tuning
in Different PCB colors is more versatile ; Fulfill a variety of
dispensing process testing ; greatly improve the equipment ( height
,volume , area ) epeatability accuracy.
3.HIGH RESOLUTION AND HIGH FRAME RATE IMAGE PROCESSING UNIT
It provides a variety of detection accuracy of
2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the
customer’s requirements for product diversity and detection speed.
4.Z-AXIS DYNAMIC COMPENSATION + TELECENTRIC LENS STATIC
COMPENSATION
Solves the problem of ordinary lens, squint and deformation by
using high-cost telecentric lens and special software test
algorithm, which greatly enhances the inspection accuracy and
inspection ability. Achieves the industry's leading static
compensation for FPC warping.
5 MINUTES PROGRAMMING AND ONE PRESS OPERATION
Engineers with any levels of experience can independently program
the system quickly and accurately through Gerber importing software
module and the friendly programming interface. One-button operation
by the operator is designed also greatly reduces the requirements
for training.
6.APPLICATION OF 3DSPI IN THE FIELD OF HIGH DENSE SOLDER PASTE
PRINTING INSPECTION
MiniLED and MicroLED are composed of small LED lights. The number
of small LEDs on a single board can reach more than 1 million pads.
The size of a single unit of MiniLED is about 100-200μm, while the
size of a single unit of MicroLED can be 50μm; therefore, the 3DSPI
equipment used in high-dense products uses the highest
configuration in the industry; especially the use of marble
platforms, linear motors and linear encoder to ensure the movement
accuracy of small-sized pads. Using the industry's leading 1.8μm
resolution telecentric lens and optimizing Gerber conversion, Load
Job, algorithm, data storage and query, etc., the accuracy, speed
and efficiency of inspection are greatly improved.
Picture show
