Features:
1. The lens of professional lens design makes the image more
uniform and delicate, and greatly improves the stability of
detection.
2. It can be imported into Gerber file programming, or can be used
to edit and debug money from image editing mode.
3.The multi direction 3D projection method can effectively solve
the detection error caused by the shadow effect in the solder paste
detection process.
4.The operation system improves the result recognition and
processing function according to the user level interface
structure.
5. High precision programmable black and white moire fringe, the
highest measuring accuracy 0.67um.
6.Based on accurate 3 dimensional measurement data, operators can
optimize the whole project in a short time.
TECHNICAL PARAMETERS:
| Model | A510 | A510DL | A1200 |
| PCB Size | 55*55 ~450*450mm | 55*55 ~450*310mm Dual | 55*55 ~ 1200*650mm |
| PCB Tickness | 0.5 ~ 7.0mm |
| PCB Weight | ≤5.0kg |
| Conveyor Adjustment | Manual/automatic |
| Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient
tin, excessive tin, bridging, offset, mal-shapes, surface
contamination) |
| Paste Height | 0 ~ 550um |
| Min Pad Pitch | ≥100um |
| Measure Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation,
Phase Measurement Profilometry) |
| Inspection Head Quantity | 1 |
| Camera Pixel | 5M, (10M/12M as option) |
| Detection Speed | 0.35 ~ 0.5s/FOV |
| Program Time | 5 ~ 10min |
| Data Type | Gerber Data 274D/274X, Scan PCB |
| Power | AC220,50/60Hz,1KVA |
| Machine Dimension | 1000*1150*1530mm | 1000*1350*1530mm | 1730*1420*1530mm |
| Weight | 965kg | 1200kg | 1600kg |
Core Technology and Features
1.PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY
Phase modulation profiling technology (PMP) is used to achieve
three-dimensional measurement of printed solder paste, which can
greatly improve measurement accuracy while ensuring high-speed
inspection.
2.ACTIVE RGB 2D LIGHT SOURCE,2D LIGHTING SOURCES
Patented RGB Tune function takes Red, Green and Blue images and
with unique filter algorism, to solve solder bridge detection false
alarm and relative zero surface uncertain issue. In the mean time,
provide the 2D/3D measurements and image of printed solder paste.
ooperate with 2D lighting sources avoids problems caused by the
angle of the red RGB color distortion effect in solder; RGB tuning
in Different PCB colors is more versatile ; Fulfill a variety of
dispensing process testing ; greatly improve the equipment ( height
,volume , area ) epeatability accuracy.
3.HIGH RESOLUTION AND HIGH FRAME RATE IMAGE PROCESSING UNIT
It provides a variety of detection accuracy of
2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the
customer’s requirements for product diversity and detection speed.
4.Z-AXIS DYNAMIC COMPENSATION + TELECENTRIC LENS STATIC
COMPENSATION
Solves the problem of ordinary lens, squint and deformation by
using high-cost telecentric lens and special software test
algorithm, which greatly enhances the inspection accuracy and
inspection ability. Achieves the industry's leading static
compensation for FPC warping.
